Aarhus, Denmark
Food and Ingredients
When:
23 July - 08 August 2025
Credits:
5 EC
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Engineering
When:
09 September - 20 September 2024
School:
Institution:
KU Leuven
City:
Country:
Language:
English
Credits:
0.0 EC
Fee:
300 EUR
Course Summary
Theme 1: Novel Materials and Characterization
Emerging 2D Materials: Exploring the synthesis and properties of novel two-dimensional materials like graphene, transition metal dichalcogenides (TMDs), and phosphorene for advanced nanoscale applications.
Advanced Characterization Techniques: Delving into cutting-edge techniques such as scanning probe microscopy, electron microscopy, and spectroscopy to characterize the structural and electronic properties of nanomaterials with high precision.
Quantum Materials: Investigating the unique quantum mechanical properties of materials, including topological insulators and quantum dots, and their potential for next-generation electronics and quantum computing.
Metamaterials and Plasmonics: Researching metamaterials with engineered electromagnetic properties and plasmonic materials for manipulating light at the nanoscale, opening up possibilities for ultra-compact photonic devices.
Nanomaterials for Energy: Studying the development of nanomaterials for energy harvesting, thermoelectric materials, and energy storage devices to address energy harvesting and storage challenges.
Theme 2: Fabrication Processes of Micro- and Nano-Systems and their Integration into Devices
Microfabrication Techniques: Exploring microfabrication methods such as photolithography, etching, and thin-film deposition for creating miniaturized electronic and MEMS (Micro-Electro-Mechanical Systems) components.
Nanomanufacturing: Investigating advanced nanomanufacturing processes like nanoimprint lithography, directed self-assembly, and molecular assembly for precise nanostructure fabrication.
MEMS and NEMS Devices: Researching the design, fabrication, and integration of Micro-Electro-Mechanical Systems (MEMS) and Nano-Electro-Mechanical Systems (NEMS) devices for various applications, from sensors to actuators.
Photonics Integration: Exploring fabrication processes and techniques for integrating photonic components into micro- and nano-systems, enabling advancements in optical communication, sensors, and signal processing.
Advanced Packaging and Interconnects: Exploring innovations in packaging technologies and interconnect solutions for enhancing the performance and reliability of micro- and nano-systems, especially in electronics and photonics applications.
All the interested PhD and postdocs, companies, and ZAP members across various disciplines including mechanical, materials, electrical and chemical engineering, physics, chemistry, and medical sciences involved in any of the above-mentioned topics.
Fee
300 EUR, early bird registration.
Fee
400 EUR, late registration.
When:
09 September - 20 September 2024
School:
Institution:
KU Leuven
Language:
English
Credits:
0.0 EC
Aarhus, Denmark
When:
23 July - 08 August 2025
Credits:
5 EC
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Paris, France
When:
07 July - 18 July 2025
Credits:
3.0 EC
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San Sebastian, Spain
When:
19 May - 13 June 2025
Credits:
8 EC
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